
Home CapabilityCapability
Below is a chart outlining PCBCORE’s manufacturing capabilities
PCB manufacturing capability
Basic information | |
Product type |
HF & RF board, HDI board, BGA& Fine Pitch board, Impedance controlled board, Thicker copper Up to |
Material |
FR4, |
Surface finish |
HASL, Lead Free HASL, OSP, Gold plating, Immersion Gold, Hard Gold, Immersion Silver, Gold fingers |
Solder mask color |
Green, Black, Blue, White, Red |
Silkscreen color |
White, Yellow, Red, Black |
Technical Specification | |
Layer count |
1 up to 30 layers |
Min. trace |
3mil |
Min. spacing |
3mil |
Min. annular ring |
3mil/sidevias, |
Min. hole size |
0.15mm(mechanical drill), 4mil(laser drill) |
Min. legend line width |
5-6mil |
Min board size |
10x |
Max board size |
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Min. PCB thickness |
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Max PCB thickness |
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Max copper weight |
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Min solder mask bridge |
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Warp and Twist |
0.7% |
Aspect ratio |
15:1 |
Line to board edge spacing |
0.2mm(Outine), 0.4mm(V-cut) |
Tolerance | |
Board thickness |
15%(board thickness > |
Plate hole size |
0.08mm(min:0.05) |
Non-plated hole size |
0.05mm(min:+0/ |
Outline dimension |
0.15mm(Routing), |
Impedance control |
5% or 10% |
FPC manufacturing capability
Items |
Specifications |
Number of Layers |
1-6 layer(Flexible) 2-14 Layer (Rigid-Flex PCB) |
Material |
Polyimid(PI) Polyester(PET) Ployterafluoroethylene (PTFE) |
Copper Weight |
1/ |
Copper type |
Rolled-annealed(RA) Half Hard Electro-deposited(ED)
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Surface Treatment
|
Immersion gold, immersion Tin, OSP |
Stiffener Supported Areas |
using FR-4, Polyamide, Polyester, etc. |
Adhesive |
Optional |
Max. board size |
475 x |
Min. PCB thickness |
1 layer: 2layer: 8 layer: 10 layer: |
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Thickness Tolerance |
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Hole Diameter Tolerance |
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Hole Position Tolerance |
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Outline Dimension Tolerance |