
Home CapabilityCapability
Below is a chart outlining PCBCORE’s manufacturing capabilities
PCB manufacturing capability
Basic information | |
Product type |
HF & RF board, HDI board, BGA& Fine Pitch board, Impedance controlled board, Thicker copper Up to |
Material |
FR4, |
Surface finish |
HASL, Lead Free HASL, OSP, Gold plating, Immersion Gold, Hard Gold, Immersion Silver, Gold fingers |
Solder mask color |
Green, Black, Blue, White, Red |
Silkscreen color |
White, Yellow, Red, Black |
Technical Specification | |
Layer count |
1 up to 30 layers |
Min. trace |
3mil |
Min. spacing |
3mil |
Min. annular ring |
3mil/sidevias, |
Min. hole size |
0.15mm(mechanical drill), 4mil(laser drill) |
Min. legend line width |
5-6mil |
Min board size |
10x |
Max board size |
|
Min. PCB thickness |
|
Max PCB thickness |
|
Max copper weight |
|
Min solder mask bridge |
|
Warp and Twist |
0.7% |
Aspect ratio |
15:1 |
Line to board edge spacing |
0.2mm(Outine), 0.4mm(V-cut) |
Tolerance | |
Board thickness |
15%(board thickness > |
Plate hole size |
0.08mm(min:0.05) |
Non-plated hole size |
0.05mm(min:+0/ |
Outline dimension |
0.15mm(Routing), |
Impedance control |
5% or 10% |
FPC manufacturing capability
Items |
Specifications |
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